Kabirkumar Mirpuri
4Patents
0h-index
13Co-inventors
28Inventor score
Filing activity: Sep 30, 2011 → Dec 20, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9324680B2 | Solder attach apparatus and method | Electricity | 0 | Active |
| US9659889B2 | Solder-on-die using water-soluble resist system and method | Electricity | 0 | Active |
| US9504168B2 | Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process | Emerging Cross-Sectional Technologies | 0 | Active |
| US10008419B2 | Separation method, computer storage medium, and separation system | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.