Method of manufacturing semiconductor device
US9324763B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 16, 2015 |
| Grant date | Apr 26, 2016 |
| Priority date | — |
| Expiry date | Jul 16, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To protect a plurality of semiconductor chips of a sawn wafer housed in a shipping case.A method of manufacturing a semiconductor device includes a step of vacuum packing a sawn wafer while being housed in a shipping case. The shipping case has the following structure. The shipping case has a lid portion that covers the upper surface of the sawn wafer and a body portion that covers the lower surface of the sawn wafer. The lid portion has a recess portion that covers a plurality of semiconductor chips and a ventilation route communicated with the recess portion. In a step of reducing pressure in the shipping case, a gas in the shipping case is discharged outside via a ventilation route.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.