Inventor · Asaka, JP

Shintaro Matsuda

11Patents
3h-index
13Co-inventors
57Inventor score

Filing activity: Mar 21, 1991 → Mar 28, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US6748704B2 Factory layout Emerging Cross-Sectional Technologies 16 Expired
US5204540A Resin sealed semiconductor device for use in testing and evaluation method of stress due to resin seal Electricity 4 Expired
US9324763B2 Method of manufacturing semiconductor device Electricity 3 Active
US10476203B2 Connector Electricity 2 Active
US10559924B2 Connector Electricity 1 Active
US10784619B2 Spring type connector Electricity 1 Active
US10290971B2 Connector fitting detection structure and connector Electricity 1 Active
US12338884B2 Vehicle drive device Mechanical Engineering; Lighting; Heating 0 Active
US12385555B2 Vehicle drive device and method for manufacturing planetary gear mechanism Mechanical Engineering; Lighting; Heating 0 Active
US11189978B2 Connector and wire harness Electricity 0 Active
US9837466B2 Method of manufacturing semiconductor device Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.