Printed wiring board
US9326376B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2014 |
| Grant date | Apr 26, 2016 |
| Priority date | — |
| Expiry date | Jan 14, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0228
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed wiring board includes: an inner layer structure body containing at least an inner layer insulative base material composed of a glass cloth and resin which covers the glass cloth and not containing a resin insulative base material composed only of resin; outer layer wiring formed on a first face of the inner layer structure body; and a solder resist layer formed on a surface of the outer layer wiring, wherein in the inner layer structure body, an opening part is formed, and the solder resist layer is composed of a first ink part covering at least the outer layer wiring that is formed on a partial region of the first face which corresponds to the opening part and a second ink part interposing both ends of the first ink part and being lower in flexibility than the first ink part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.