MEMS device and corresponding micromechanical structure with integrated compensation of thermo-mechanical stress
US9327962B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 25, 2014 |
| Grant date | May 3, 2016 |
| Priority date | — |
| Expiry date | Apr 17, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0831
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A micromechanical structure of a MEMS device, integrated in a die of semiconductor material provided with a substrate and having at least a first axis of symmetry lying in a horizontal plane, has a stator structure, which is fixed with respect to the substrate, and a rotor structure, having a suspended mass, mobile with respect to the substrate and to the stator structure as a result of an external action, the stator structure having fixed sensing electrodes capacitively coupled to the rotor structure; a compensation structure is integrated in the die for compensation of thermo-mechanical strains. The compensation structure has stator compensation electrodes, which are fixed with respect to the substrate, are capacitively coupled to the rotor structure, and are arranged symmetrically to the fixed sensing electrodes with respect to the first axis of symmetry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.