Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device
US9329475B2 · kind B2 · utility
1Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 2014 |
| Grant date | May 3, 2016 |
| Priority date | — |
| Expiry date | May 21, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G73/22
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed are a positive photosensitive resin composition including (A) a polybenzoxazole precursor including a functional group at a terminal end thereof, wherein the functional group is dissociated by light of about 400 nm to about 550 nm wavelength region and is acidified; (B) a photosensitive diazoquinone compound; and (C) a solvent, and a photosensitive resin film and a display device using the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.