Patent · US Active

Systems and methods for horizontal integration of acceleration sensor structures

US9330929B1 · kind B1 · utility

7Cited by

2References

12Claims

0Family size

Assignee

Infineon Technologies Dresden GmbH & Co. KG · DE

Inventors

Thoralf Kautzsch · Dresden, DE
Heiko Fröhlich · Radebeul, DE
Mirko Vogt · Dresden, DE
Maik Stegemann · Freital, DE
Andre Röth · Zofingen, CH
Steffen Bieselt · Wehlen, DE

Key dates

Filing date	Oct 13, 2014
Grant date	May 3, 2016
Priority date	—
Expiry date	Oct 13, 2034

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2203/0764
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

Embodiments relate to integrated circuit sensors, and more particularly to sensors integrated in an integrated circuit structure and methods for producing the sensors. In an embodiment, a sensor device comprises a substrate; a first trench in the substrate; a first moveable element suspended in the first trench by a first plurality of support elements spaced apart from one another and arranged at a perimeter of the first moveable element; and a first layer arranged on the substrate to seal the first trench, thereby providing a first cavity containing the first moveable element and the first plurality of support elements.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.