Semiconductor module system, semiconductor module arrangement and method for mounting a semiconductor module on a heat sink
US9330996B2 · kind B2 · utility
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1References
19Claims
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Assignee
Inventor
Key dates
| Filing date | Apr 15, 2014 |
| Grant date | May 3, 2016 |
| Priority date | — |
| Expiry date | Apr 15, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module system has a semiconductor module and a protective cover. The semiconductor module has a bottom side with a heat dissipation surface and a top side opposite the bottom side, the top side being separated from the bottom side in a vertical direction. The protective cover can be mounted irreleasably on the semiconductor module in such a way that, in a mounted state, the top side is exposed and the protective cover covers the heat dissipation surface. By virtue of the protective cover, a thermal interface material applied onto the heat dissipation surface can be protected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.