Multi-component integrated heat spreader for multi-chip packages
US9330999B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2014 |
| Grant date | May 3, 2016 |
| Priority date | — |
| Expiry date | Jun 5, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49352
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-component heat spreader comprising a top component having a first surface and an opposing second surface with either a cavity extending therein from the second surface thereof or a projection extending from the second surface thereof. The multi-component heat spreader further includes at least one additional component, such as a footing component or a spacer component, having a first surface and an opposing second surface with either a cavity extending therein from the second surface thereof or a projection extending from the second surface thereof, which is opposite from the top component cavity/projection. The additional component is attached to the top component, such as by brazing, wherein the top component cavity/projection is mated to the additional component cavity/projection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.