Hybrid bonding and apparatus for performing the same
US9331032B2 · kind B2 · utility
22Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2013 |
| Grant date | May 3, 2016 |
| Priority date | — |
| Expiry date | Mar 6, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01322
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes performing a hybrid bonding to bond a first package component to a second package component, so that a bonded pair is formed. In the bonded pair, first metal pads in the first package component are bonded to second metal pads in the second package component, and a first surface dielectric layer at a surface of the first package component is bonded to a second surface dielectric layer at a surface of the second package component. After the hybrid bonding, a thermal compressive annealing is performed on the bonded pair.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.