Yan-Chih Lu
8Patents
2h-index
18Co-inventors
40Inventor score
Filing activity: Mar 6, 2013 → Mar 2, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9728521B2 | Hybrid bond using a copper alloy for yield improvement | Electricity | 201 | Active |
| US9331032B2 | Hybrid bonding and apparatus for performing the same | Electricity | 22 | Active |
| US10297631B2 | Metal block and bond pad structure | Electricity | 0 | Active |
| US9865630B2 | Image sensor pickup region layout | Electricity | 0 | Active |
| US11335716B2 | Photosensing pixel, image sensor and method of fabricating the same | Electricity | 0 | Active |
| US9391101B2 | Image sensor pickup region layout | Electricity | 0 | Active |
| US11088192B2 | Metal block and bond pad structure | Electricity | 0 | Active |
| US10490580B2 | Image sensor pickup region layout | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.