Semiconductor die laminating device with independent drives
US9331045B2 · kind B2 · utility
1Cited by
1References
20Claims
0Family size
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Key dates
| Filing date | May 7, 2012 |
| Grant date | May 3, 2016 |
| Priority date | — |
| Expiry date | May 7, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A laminating device (230) and method are disclosed for laminating semiconductor die (220) on substrates on a panel (200) of substrates. The laminating device (230) includes lamination units (234,236,238,240) that operate independently of each other so that a row or column of semiconductor die (220) may be independently laminated onto a row or column of substrates simultaneously.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.