Methods, systems, and apparatuses for temperature compensated surface acoustic wave device
US9331667B2 · kind B2 · utility
5Cited by
8References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2014 |
| Grant date | May 3, 2016 |
| Priority date | — |
| Expiry date | Jul 21, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/883
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Embodiments described herein may provide a temperature-compensated surface acoustic wave (TCSAW) device, a method of fabricating a TCSAW device, and a system incorporating a TCSAW device. The TCSAW device may include a pyroelectric substrate, a plurality of electrodes formed on a first surface of the pyroelectric substrate, an amorphous silicon layer formed over the plurality of electrodes, and a temperature compensating layer formed over the amorphous silicon layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.