Patent · US Active

Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals

US9332330B2 · kind B2 · utility

11Cited by

6References

12Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Klaus Elian · Alteglofsheim, DE
Horst Theuss · Wenzenbach, DE
Thomas Mueller · Lappersdorf, DE

Key dates

Filing date	Jul 22, 2013
Grant date	May 3, 2016
Priority date	—
Expiry date	Sep 10, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH04R2499/11
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A surface mountable microphone package includes a first microphone and a second microphone. Furthermore, the surface mountable microphone package includes a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.