Underfill sealant composition
US9334429B2 · kind B2 · utility
0Cited by
5References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2014 |
| Grant date | May 10, 2016 |
| Priority date | — |
| Expiry date | Mar 7, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73204
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention provides a composition which does not cause the problem of use at high temperature in the mounting process of electronic device. The present invention relates to an underfill sealant composition comprising (a) a (meth)acrylic compound and (c) an isocyanuric acid having an allyl group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.