Yusuke Horiguchi
9Patents
2h-index
18Co-inventors
44Inventor score
Filing activity: Dec 1, 2006 → Apr 5, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8048615B2 | Silicon-containing resist underlayer coating forming composition for forming photo-crosslinking cured resist underlayer coating | Electricity | 11 | Active |
| US8481247B2 | Resist underlayer film forming composition containing liquid additive | Electricity | 6 | Active |
| US8227172B2 | Method of producing semiconductor device using resist underlayer film by photo-crosslinking curing | Emerging Cross-Sectional Technologies | 2 | Active |
| US9436085B2 | Composition for forming photosensitive resist underlayer film | Physics | 1 | Active |
| US10242923B2 | Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packages | Physics | 1 | Active |
| US9771500B2 | Sealant composition for electronic device | Electricity | 0 | Active |
| US9334429B2 | Underfill sealant composition | Electricity | 0 | Active |
| US9576871B2 | Composition for electronic device | Electricity | 0 | Active |
| US11203181B2 | Barrier film-containing format and the use thereof for pre-applied underfill film for 3D TSV packages | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.