Multilayer ceramic electronic component and assembly board having the same
US9336946B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2014 |
| Grant date | May 10, 2016 |
| Priority date | — |
| Expiry date | Oct 18, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10015
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present application describes a multilayer ceramic electronic component including a ceramic body having a thickness greater than a width and includes a dielectric layers, and has upper and lower surfaces opposing each other in a thickness direction. First and second side surfaces oppose each other in a width direction, and first and second end surfaces oppose each other in a length direction. First and second internal electrodes are stacked with at least one of the dielectric layers interposed therebetween within the ceramic body in the width direction. A volume increasing part is disposed in a lower portion of the ceramic body in the thickness direction to allow a volume of a lower margin portion of the ceramic body to be greater than that of an upper margin portion thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.