Semiconductor component with moisture barrier for sealing semiconductor body

US9337155B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Gottfried Beer · Nittendorf, DE
• Juergen Hoegerl · Regensburg, DE
• Thilo Stolze · Arnsberg, DE

Key dates

• Filing date: Mar 13, 2014
• Grant date: May 10, 2016
• Expiry date: Apr 24, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor component includes a semiconductor body having a top side and a bottom side opposite the top side. A top metallization is applied to the top side and a bottom metallization is applied to the bottom side. A moisture barrier completely seals the semiconductor body in cooperation with the top metallization and the bottom metallization.