High productivity spray processing for the metallization of semiconductor workpieces
US9337374B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2012 |
| Grant date | May 10, 2016 |
| Priority date | — |
| Expiry date | Sep 20, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/547
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Processing equipment for the metallization of a plurality of semiconductor workpieces. A controlled atmospheric non-oxidizing gas region comprises at least two enclosed deposition zones, the controlled atmospheric non-oxidizing gas region is isolated from external oxidizing ambient. A temperature controller adjusts the temperature of the semiconductor workpiece in each of the at least two enclosed deposition zones. Each of the enclosed deposition zones comprising at least one spray gun for the metallization of the semiconductor workpiece. A transport system moves the semiconductor workpiece through the controlled atmospheric non-oxidizing gas region. A batch carrier plate carries the semiconductor workpiece through the controlled atmospheric non-oxidizing gas region. The controlled atmospheric non-oxidizing gas region further comprises a gas-based pre-cleaning zone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.