Heated platen with improved temperature uniformity
US9338829B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2014 |
| Grant date | May 10, 2016 |
| Priority date | — |
| Expiry date | Aug 7, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67103
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A heated platen with improved temperature uniformity is generally described. Various examples provide a platen portion with a metallization layer thermally coupled thereto. An electrical contact may be connected to the metallization layer and configured to conduct an electric current for heating the metallization layer and the platen portion. The electrical contact may include an electrical conductor and a resistive heating element that is configured to heat up when electric current flows therethrough, thereby creating a thermal block that reduces an amount of heat that is absorbed into the electrical contact from the platen portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.