Method of producing a printed wiring board
US9338898B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2013 |
| Grant date | May 10, 2016 |
| Priority date | — |
| Expiry date | Dec 3, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12438
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method-of producing a printed wiring board comprises: forming a via-hole for interlayer connection in a laminate in which a copper foil for laser processing comprises a copper foil and an easily soluble laser absorption layer provided on a surface of the copper foil which has a higher etching rate to a copper etchant than the copper foil and absorbs an infrared laser beam and another conductor layer is laminated through an insulating layer, directly irradiating the infrared laser beam on the easily soluble laser absorption layer; and removing the easily soluble laser absorption layer from the surface of the copper foil in a desmear step of removing a smear in a via-hole and/or a microetching step as a pretreatment of an electroless plating step is adopted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.