System for removing an electronic component from a substrate
US9338935B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2014 |
| Grant date | May 10, 2016 |
| Priority date | — |
| Expiry date | Dec 6, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53274
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system and method for removing an electronic component from a substrate is described. In one embodiment, a system includes a heating device to heat a substrate, wherein an electronic component such as a microchip is attached to the substrate by one or more solder connections. A thermally conductive picker head is placed in physical contact with the electronic component to apply tension to the electronic component and draw heat away from the electronic component through a thermally conductive interface between the electronic component and the thermally conductive picker head. This ideally generates a uniform temperature gradient across the solder connections. This will allow the electronic component along with most or all of the solder to be removed from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.