Mixed abrasive polishing compositions
US9340706B2 · kind B2 · utility
0Cited by
22References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2013 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | Feb 20, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides chemical-mechanical polishing compositions and methods of chemically-mechanically polishing a substrate with the chemical-mechanical polishing compositions. The polishing compositions comprise first abrasive particles, wherein the first abrasive particles are ceria particles, second abrasive particles, wherein the second abrasive particles are ceria particles, surface-modified silica particles, or organic particles, a pH-adjusting agent, and an aqueous carrier. The polishing compositions also exhibit multimodal particle size distributions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.