Cleaning composition and method of manufacturing metal wiring using the same
US9340759B2 · kind B2 · utility
5Cited by
8References
18Claims
0Family size
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Key dates
| Filing date | Apr 29, 2014 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | Apr 29, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/125
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A cleaning composition includes about 0.01 to about 5 wt % of a chelating agent; about 0.01 to about 0.5 wt % of an organic acid; about 0.01 to about 1.0 wt % of an inorganic acid; about 0.01 to about 5 wt % of an alkali compound; and deionized water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.