Compositions for polishing aluminum/copper and titanium in damascene structures
US9343330B2 · kind B2 · utility
34Cited by
17References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2006 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | Sep 8, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides a chemical-mechanical polishing composition for polishing a substrate. The polishing composition comprises an oxidizing agent, calcium ion, an organic carboxylic acid, and water, wherein the polishing composition has a pH of about 1.5 to about 7. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.