Substrate-product substrate combination and device and method for producing a substrate-product substrate combination
US9343348B2 · kind B2 · utility
1Cited by
3References
4Claims
0Family size
Inventor
Key dates
| Filing date | Jun 12, 2012 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | Jun 12, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68327
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a substrate for producing a substrate-product substrate combination by aligning, bringing into contact, and bonding a contact side of the large-area substrate to a support surface of a carrier substrate, whereby the substrate has a diameter d1, which can be reduced during back-thinning.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.