Patent · US Active

Semiconductor component with integrated crack sensor and method for detecting a crack in a semiconductor component

US9343381B2 · kind B2 · utility

0Cited by

1References

18Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Markus Zundel · Egmating, DE
Uwe Schmalzbauer · Neubiberg, DE
Rudolf Zelsacher · Klagenfurt, AT

Key dates

Filing date	May 22, 2013
Grant date	May 17, 2016
Priority date	—
Expiry date	Sep 22, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/13091
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A first embodiment relates to a semiconductor component. The semiconductor component has a semiconductor body with a bottom side and a top side spaced distant from the bottom side in a vertical direction. In the vertical direction, the semiconductor body has a certain thickness. The semiconductor component further has a crack sensor configured to detect a crack in the semiconductor body. The crack sensor extends into the semiconductor body. A distance between the crack sensor and the bottom side is less than the thickness of the semiconductor body.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.