Semiconductor package and method of manufacturing the same
US9343391B2 · kind B2 · utility
1Cited by
0References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2014 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | Jun 4, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19106
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are a semiconductor package and a method of manufacturing the same. The semiconductor package includes: a substrate including a mounting electrode formed on both sides and a wiring; a plurality of first electronic devices mounted on the substrate; a second electronic devices mounted on the substrate; and a via through which the wiring of the substrate and the second electronic devices are connected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.