Stacked package and method of manufacturing the same
US9343436B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2014 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | Dec 4, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15788
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A stacked package includes a substrate, and a first structure bonded to the substrate. The first structure has a plurality of bumps, and a first hydrophilic coating is on sidewalls of the first structure. The stacked package further includes a second structure bonded to the plurality of bumps. The first hydrophilic coating is on sidewalls of the second structure. The first structure is between the second structure and the substrate. The stacked package further includes a housing, wherein the housing defines a volume enclosing the first structure and the second structure. A second hydrophilic coating is on sidewalls of an inner surface of the housing. The stacked package further includes a cooling fluid within the volume enclosing the first structure and the second structure. A top surface of the cooling fluid is above a top surface of the second structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.