Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards
US9345149B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2010 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | Dec 30, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.