Magnetic field shielding for packaging build-up architectures
US9345184B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2013 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | Oct 2, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Magnetic field shielding material with high relative permeability incorporated into a build-up package, for example to restrict a field of a magnet integrated with the build-up to a target device configured to operate in the field. In embodiments, a first device is physically coupled to the build-up. In embodiments, a magnetic field shielding material is disposed in contact with the build-up and in proximity to the first device to restrict a magnetic field either to a region occupied by the first device or to a region exclusive of the first device. A field shielding material may be disposed within build-up near a permanent magnet also within the build-up to reduce exposure of another device, such as an IC, to the magnetic field without reducing MEMS device exposure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.