Method for manufacturing flexible substrate with surface structure copying from a template
US9346196B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 2012 |
| Grant date | May 24, 2016 |
| Priority date | — |
| Expiry date | Jan 29, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24479
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Disclosed herein are a flexible substrate with surface structure and a method for manufacturing the flexible substrate. The disclosure relates to a low-cost process to manufacturing the flexible substrate that is adapted to the large-area mass production. According to one of the embodiments in the disclosure, the method introduces a mold with surface structure. An isolation material is formed on the mold surface in an earlier stage. Upon the isolation layer, a flexible substrate material is coated. After that, a baking step is employed to cure the flexible substrate material. The flexible substrate with surface structure is therefore formed after de-molding the cured substrate. Another aspect to the disclosure adopts the above-formed substrate to be a base substrate. A second flexible substrate with the surface structure identical to the mold is then formed by performing the above steps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.