Robust MEMS structure with via cap and related method
US9346669B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 2015 |
| Grant date | May 24, 2016 |
| Priority date | — |
| Expiry date | May 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/23
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Self-supported MEMS structure and method for its formation are disclosed. An exemplary method includes forming a polymer layer over a MEMS plate over a substrate, forming a via collar along sidewalls of a first portion of a trench over the polymer layer, and forming a second portion of the trench within the polymer layer. The method also includes forming an oxide liner in the trench lining sidewalls of the via collar and sidewalls of the second portion of the trench, depositing a metallic filler in the trench to form a via, and forming a metal cap layer over the via collar and the metallic filler. The method further includes removing a portion of the metal cap layer to form a via cap, and removing the polymer layer such that the via is supported only on a bottom thereof by the substrate. An exemplary structure formed by the disclosed method is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.