Patent · US Active

Coating substrates with an alloy by means of cathode sputtering

US9347131B2 · kind B2 · utility

12Cited by
9References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 28, 2011
Grant dateMay 24, 2016
Priority date
Expiry dateSep 28, 2031

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J37/3429
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

The invention relates to a target for coating a substrate with an alloy by means of cathode sputtering, said alloy having at least one first material and one second material as alloy components. The surface of the target has at least one first section made of the first material and one second section made of the second material. The two sections adjoin each other and form a common boundary line. The invention further relates to a device and a method for coating a substrate with an alloy by means of cathode sputtering using the target according to the invention.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.