Coating substrates with an alloy by means of cathode sputtering
US9347131B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2011 |
| Grant date | May 24, 2016 |
| Priority date | — |
| Expiry date | Sep 28, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3429
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention relates to a target for coating a substrate with an alloy by means of cathode sputtering, said alloy having at least one first material and one second material as alloy components. The surface of the target has at least one first section made of the first material and one second section made of the second material. The two sections adjoin each other and form a common boundary line. The invention further relates to a device and a method for coating a substrate with an alloy by means of cathode sputtering using the target according to the invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.