Nonvolatile memory device having authentication, and methods of operation and manufacture thereof
US9348995B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2015 |
| Grant date | May 24, 2016 |
| Priority date | — |
| Expiry date | May 7, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A memory device package encloses two separate die, one being a standard nonvolatile memory integrated circuit (“IC”) die, and the other being any suitable authentication IC die. Either die may be stacked upon the other, or the die may be placed side-by-side. The external contacts may correspond to the power and signal requirements of the standard nonvolatile memory IC die so that the pin-out of the memory device package may present a standard pinout. The power and signal requirements of the authentication IC die may be satisfied with some or all of the pins for the nonvolatile memory integrated circuit die, or with other unused pins of the device package. One or more additional external contacts may be added exclusively for the authentication integrated circuit die. One or more signals may be dedicated as between the standard nonvolatile memory IC die and the authentication IC die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.