Liquid chemical for forming water repellent protecting film, and process for cleaning wafers using the same
US9349582B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2012 |
| Grant date | May 24, 2016 |
| Priority date | — |
| Expiry date | Feb 26, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02093
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A liquid chemical for forming a water repellent protecting film on a wafer having at its surface an uneven pattern and containing at least one kind of element selected from the group consisting of titanium, tungsten, aluminum, copper, tin, tantalum and ruthenium at surfaces of recessed portions of the uneven pattern, the water repellent protecting film being formed at least on the surfaces of the recessed portions. The liquid chemical is characterized by including: a water repellent protecting film forming agent; and water, and characterized in that the water repellent protecting film forming agent is at least one selected from compounds represented by the following general formula [1] and salt compounds thereof and that the concentration of the water relative to the total quantity of a solvent contained in the liquid chemical is not smaller than 50 mass %.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.