Integrated circuit manufacturing tool condition monitoring system and method
US9349660B2 · kind B2 · utility
2Cited by
19References
20Claims
0Family size
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Key dates
| Filing date | Dec 1, 2011 |
| Grant date | May 24, 2016 |
| Priority date | — |
| Expiry date | Dec 11, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system and method for monitoring a process tool of an integrated circuit manufacturing system are disclosed. An exemplary method includes defining zones of an integrated circuit manufacturing process tool; grouping parameters of the integrated circuit manufacturing process tool based on the defined zones; and evaluating a condition of the integrated circuit manufacturing process tool based on the grouped parameters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.