Method of manufacturing stacked package
US9349667B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2014 |
| Grant date | May 24, 2016 |
| Priority date | — |
| Expiry date | May 30, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a stacked package includes a first process of stacking a semiconductor chip on an upper surface of a PCB having a wiring pattern and a via-hole pad, a second process of forming a photoresist (PR) layer on the upper surface of the PCB having the semiconductor chip and the via-hole pad, a third process of removing the photoresist layer of a remaining region except for an upper portion of the via-hole pad so that a photoresist layer of a via-hole region remains only at the upper portion of the via-hole pad, a fourth process of forming a molding layer by molding the upper surface of the PCB having the semiconductor chip to expose an upper surface of the photoresist layer of the via-hole region, and a fifth process of removing the photoresist layer of the via-hole region to form a via-hole on the via-hole pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.