Wafer level lens in package
US9354111B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 2014 |
| Grant date | May 31, 2016 |
| Priority date | — |
| Expiry date | Aug 6, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J1/4204
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A wafer level optical device, system, and method are described that include a substrate, an electronic device disposed on the substrate, an illumination source disposed on the electronic device, an enclosure disposed on the substrate, where the enclosure includes at least one optical surface and covers the electronic device and the illumination source, and at least one solder ball disposed on a side of the substrate distal from the electronic device. In implementations, a process for using the wafer level optical device and lens-integrated package system that employ the techniques of the present disclosure includes receiving a substrate, placing an electronic device on the substrate, placing an illumination source on the electronic device, and placing an enclosure on the substrate, where the enclosure covers the electronic device and the illumination source, and the enclosure and a wall structure form a first compartment and a second compartment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.