Overvoltage protection component and an assembly of integrated circuit chips having said overvoltage protection component
US9354391B2 · kind B2 · utility
1Cited by
1References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 24, 2014 |
| Grant date | May 31, 2016 |
| Priority date | — |
| Expiry date | Sep 24, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1431
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device includes integrated circuit chips mounted on one another. At least one component for protecting elements of a second chip is formed in a first chip. The chips may be of the SOI type, with the first chip including a first SOI layer having a first thickness and the second chip including a second SOI layer having a second thickness smaller than the first thickness. The first chip including the component for protecting may include an optical waveguide with the component for protecting formed adjacent the optical waveguide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.