Method and apparatus for liquid treatment of wafer shaped articles
US9355836B2 · kind B2 · utility
1Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2013 |
| Grant date | May 31, 2016 |
| Priority date | — |
| Expiry date | Dec 31, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6708
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
In an apparatus and method for treating a wafer-shaped article, a spin chuck is provided for holding and rotating a wafer-shaped article. A first liquid dispenser communicates with a supply of an organic liquid and is positioned so as to dispense the organic liquid onto a surface of a wafer-shaped article. A degasifying unit is positioned upstream of the first liquid dispenser and downstream of the supply. The degasifying unit is configured to reduce a dissolved gas content of the organic liquid to less than 20% of a saturation concentration at a pressure of 1 bar.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.