Patent · US Active

Methods and systems for inspecting bonded wafers

US9355919B2 · kind B2 · utility

1Cited by

2References

18Claims

0Family size

Assignee

Nanda Technologies GmbH · DE

Inventors

Markus Estermann · Babensham, DE
Christoph Kappel · Aschheim, DE
Reza Kharrazian · Stephanskirchen, DE
Lars Markwort · Haimhausen, DE

Key dates

Filing date	Aug 23, 2011
Grant date	May 31, 2016
Priority date	—
Expiry date	Feb 29, 2032

Classification

Technology area (CPC G)Physics
CPC primaryG01N21/9501
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A method of inspecting a bonded wafer 3 arrangement comprises:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.