Method of forming metal and metal alloy features
US9359683B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2007 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Oct 29, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Electric potential, current density, agitation, and deposition rate are controlled to deposit metal alloys, such as tin based solder alloys or magnetic alloys, with minimal variations in the weight ratios of alloying metals at different locations within the deposited metal alloy feature. Alternative embodiments include processes that form metal alloy features wherein the variation in weight ratio of alloying metals within the feature is not necessarily minimized, but is controlled to provide a desired variation. In addition to metal alloys, alternative embodiments include processes for improving the deposition of single metal features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.