Patent · US Active

Gyro MEMS sensor package

US9360318B1 · kind B1 · utility

6Cited by

5References

18Claims

0Family size

Assignee

Technology Partners LLC · GB

Inventors

Kelvin Po Leung Pun · Sha Tin, CN
Chee Wah Cheung · Sha Tin, CN

Key dates

Filing date	Dec 23, 2014
Grant date	Jun 7, 2016
Priority date	—
Expiry date	Dec 23, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

An integrated circuit packaging structure comprises at least one Micro Electrical Mechanical Systems (MEMS) gyroscope die mounted directly on a multi-layer flexible substrate having at least one metal layer and wire-bonded to the flexible substrate and a lid or die coating protecting the MEMS die and wire bonds.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.