Inventor · Sha Tin, CN

Chee Wah Cheung

22Patents
3h-index
11Co-inventors
56Inventor score

Filing activity: Sep 26, 2006 → Jun 21, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US9360318B1 Gyro MEMS sensor package Electricity 6 Active
US7906844B2 Multiple integrated circuit die package with thermal performance Electricity 5 Active
US10103095B2 Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect Electricity 4 Active
US7573131B2 Die-up integrated circuit package with grounded stiffener Electricity 3 Active
US11076491B2 Integrated electro-optical flexible circuit board Electricity 3 Active
US10917973B1 Method of direct embedding a lithium ion battery on a flexible printed circuit board Emerging Cross-Sectional Technologies 2 Active
US10468342B2 Formation of fine pitch traces using ultra-thin PAA modified fully additive process Electricity 1 Active
US10923449B2 Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect Electricity 1 Active
US11295891B2 Electric coil structure Electricity 1 Active
US10510653B2 Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect Electricity 1 Active
US8361837B2 Multiple integrated circuit die package with thermal performance Electricity 1 Active
US11749595B2 Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect Electricity 0 Active
US11069606B2 Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect Electricity 0 Active
US10636734B2 Formation of fine pitch traces using ultra-thin PAA modified fully additive process Electricity 0 Active
US11764392B2 Battery assembly and method of manufacturing the same Emerging Cross-Sectional Technologies 0 Active
US10362680B2 Patterning of graphene circuits on flexible substrates Electricity 0 Active
US10643942B2 Formation of fine pitch traces using ultra-thin PAA modified fully additive process Electricity 0 Active
US9974188B2 Patterning of graphene circuits on flexible substrates Electricity 0 Active
US11594509B2 Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect Electricity 0 Active
US11553598B2 Integrated electro-optical flexible circuit board Electricity 0 Active
US9637376B2 Gyro MEMS sensor package Electricity 0 Active
US12249704B2 Method of direct embedding a lithium ion battery on a flexible printed circuit board Emerging Cross-Sectional Technologies 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.