Lithography process and composition with de-crosslinkable crosslink material
US9362120B2 · kind B2 · utility
4Cited by
11References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 10, 2014 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Nov 10, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0276
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present disclosure provides a method that includes forming a polymeric material layer on a substrate, wherein the polymeric material layer includes de-crosslinkable crosslink material (DCM); performing a first baking process having a first baking temperature to the polymeric material layer, thereby initiating crosslinking function of the DCM; and performing a second baking process having a second baking temperature to the polymeric material layer, thereby initiating de-crosslinking function of the DCM.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.