Method for manufacturing a multilayer structure on a substrate
US9362255B2 · kind B2 · utility
0Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2012 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Dec 27, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/80896
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for manufacturing a multilayer strucute on a first substrate, the method including: using the first substrate made of a first material having a Young's modulus Ev and a thickness ev, and using a second substrate covered by the multilayer structure, the second substrate being made of a second material having a Young's modulus Es that is different from the Young's modulus Ev and a thickness es, the thicknesses es and ev complying, plus or minus 10%, with the relation (I); molecularly bonding the first substrate and the multilayer structure together; and removing the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.