Vincent Larrey
15Patents
3h-index
29Co-inventors
56Inventor score
Filing activity: Jun 22, 2009 → Mar 16, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8692337B2 | Structure with a moving portion and a buried electrode for movement detection included in a multi-substrate configuration | Electricity | 16 | Active |
| US7906439B2 | Method of fabricating a MEMS/NEMS electromechanical component | Emerging Cross-Sectional Technologies | 12 | Active |
| US9029178B2 | Method for producing a device comprising cavities formed between a suspended element resting on insulating pads semi-buried in a substrate and this substrate | Performing Operations; Transporting | 5 | Active |
| US7993949B2 | Heterogeneous substrate including a sacrificial layer, and a method of fabricating it | Performing Operations; Transporting | 3 | Active |
| US9783407B2 | Method for making a suspended membrane structure with buried electrode | Performing Operations; Transporting | 1 | Active |
| US10290721B2 | Method of fabricating an electromechanical structure including at least one mechanical reinforcing pillar | Electricity | 0 | Active |
| US12334347B2 | Detachable structure used for transferring or handling layers, and process for transferring a layer using the detachable structure | Electricity | 0 | Active |
| US8999860B2 | Process for producing at least one silicon-based nanoelement in a silicon oxide section and process for the manufacture of a device employing the production process | Electricity | 0 | Active |
| US10957539B2 | Method for bonding by direct adhesion | Electricity | 0 | Active |
| US9362255B2 | Method for manufacturing a multilayer structure on a substrate | Electricity | 0 | Active |
| US12417942B2 | Process for hydrophilically bonding substrates | Electricity | 0 | Active |
| US10643884B2 | Method for manufacturing a semiconductor structure with temporary direct bonding using a porous layer | Electricity | 0 | Active |
| US8076169B2 | Method of fabricating an electromechanical device including at least one active element | Performing Operations; Transporting | 0 | Active |
| US11054402B2 | Method and device for checking a bond between two substrates | Physics | 0 | Active |
| US11081463B2 | Bonding method with electron-stimulated desorption | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.