Method of fabricating heat dissipating board
US9363885B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2013 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Jan 15, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1194
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a heat dissipating board according to the present invention, includes: a substrate intermediate forming step of forming a substrate intermediate with an insulating layer made of an insulating resin material and a conducting layer made of a conductive material formed on the insulating layer; a through hole forming step of forming a through hole having an approximately cylindrical shape, the through hole penetrating through the substrate intermediate; an inserting step of inserting a heat conducting member to be disposed in the through hole, the heat conducting member being made of a metal and having an approximately cylindrical shape; and a plastically deforming step of plastically deforming the heat conducting member to be secured in the through hole. Prior to the inserting step, an annealing step of annealing the heat conducting member is performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.