Making a plurality of integrated circuit packages
US9363901B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2015 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Dec 10, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/49555
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making a plurality of integrated circuit packages provides a metal strip. A first leadframe having a first die pad is formed on the metal strip. Also formed are a first plurality of leads with proximal ends adjacent to the first die pad, free distal ends positioned outwardly from the first die pad, and a first leadframe dam bar intersecting the proximal ends of the first plurality of leads. A second leadframe having a second die pad, a second plurality of leads with proximal ends adjacent to the second die pad and free distal ends positioned outwardly from the second die pad and a second leadframe dam bar intersecting the proximal ends of the second plurality of leads are formed on the metal strip. The free distal ends of said second plurality of leads are aligned with and adjacent to said free distal ends of said first plurality of leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.